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產(chǎn)品詳情

詳細說明Detailed description：

新式流線型的外觀設計，推拉式鋼化玻璃門，

使內(nèi)部維護空間加大。

New-moder streamiline appearance design,

push-pull toughened glass door which

enlarges inner space for maintenance。

直聯(lián)式入板結(jié)構(gòu)，特制不銹鋼鏈條傳輸，入

板裝置采用與主運輸系統(tǒng)一體的結(jié)構(gòu)，保證

PCB板順利進入輸送系統(tǒng),經(jīng)久耐用。

Direct-link structure for board loading tailor-made stainless chain conveyor, integrating the board-loading equipment to main conveyor for ensuring the PCB loading in conveyor system smoothly,wear well。

PCB輸送導軌傾斜角度采用絲桿調(diào)整，結(jié)構(gòu)簡潔，調(diào)節(jié)方便。

String-pole adiustmnt for the lean angle of PCB conveyor rail,simple structure,easy to handle。

預熱系統(tǒng)采用遠紅外發(fā)熱管,控溫采用PID方式、模擬量自動調(diào)整電壓相角，使溫控精度達到±2℃，本預熱系統(tǒng)配有特制耐高溫鋼化玻璃，與遠紅外紅外線發(fā)熱管組合，可達到理想的無鉛焊接預熱溫度。特殊結(jié)構(gòu)設計，使預熱區(qū)與焊接區(qū)的溫度下降值＜5℃。

Adopting infrared heater to preheating system.PID temperature control and auto-adjusted voltage phase by simulation to improve the temperature tolerance up to ±2oC,This preheating system is equipped with high-temperature proof glass which can achieve perfect lead-free soldering preheating temperature combining with infrared heater.Its special structural design allows the temperature drop from preheating zone to soldering zone less than 5oC.
錫爐采用外發(fā)熱板式加熱，爐膽體積減小，發(fā)熱體均勻布置，提高溫度均衡性；新型波峰噴口，適合新一代的焊接工藝，波峰平穩(wěn)，氧化量小。（第一波峰搖擺功能為可選項）

Outer-heating for the solder pot with shrunk size of container and evenly distributed heater to improve the proportion of temperature;new type wave nozzle which fits to the new soldering technique with steady wave and low oxidation.(Swing function for the first wave is optional)

抽風裝置采用過濾形式，有利于環(huán)保。

Filter-mode to the exhausting system beneficial to environmental protection.

寬窄調(diào)整采用同軸、同步調(diào)整，緊密準確，調(diào)節(jié)靈活。

Coaxial and synchronous adjustment for the width,precise,accurate and flexible.

新型的噴霧裝置霧化均勻，調(diào)節(jié)方便，使助焊劑得以充分利用，能適用不同的助焊劑(發(fā)泡式為另選項）。

New model spray system with uniform atomization,easy for adjustment,which makes a full utilization of the fluxer and fits to different.

輸送機構(gòu)采用浮動式結(jié)構(gòu)，有效防止導軌變形。

The floating structure is adopted in the conveying mechanism to effectively prevent the deformation of the guide rail。

儀表式操作系統(tǒng)，OMRON PLC作為主控系統(tǒng)，自動識別和調(diào)節(jié)線路板的長度和寬度，溫度控制采用OMRON溫控儀表，用自動調(diào)節(jié)功能來實現(xiàn)PID控溫，從而達到穩(wěn)定的控溫和焊接效果。

Meter-type operating system, OMRON PLC as the main control system, automatically identifies and adjusts the length and width of circuit board. Temperature control uses OMRON temperature control instrument, and realizes PID temperature control with automatic adjustment function, so as to achieve stable temperature control and welding effect。

規(guī)格 Specifications

Conveyor Motor	運輸馬達	1￠ 220V 60W
Conveyor Speed	運輸速度	0.5-1.8m/min
P.C.Board Size	基板尺寸	50-300mm (w)
Air Pressure of Spray Fluxer	松香裝置氣壓	3-5 Bar
Fluxer volume	松香裝置容量	Approx.12Liters
Pre-heater	預加熱器1.2M(L)	220V 700W*12pcs(Ceramic heater)
Solder Pot Heater	錫爐發(fā)熱管	220V 1200W*9pcs
Solder volume	錫爐錫容量	Approx0．450kg
Wave Motor	波峰馬達	3￠ 220V 180w×2pcs
Solder Temperature	錫爐溫度	Max 300℃
Cooling Fan	冷卻風扇	220V? 30w
Finger Cleaning Motor	洗爪馬達	220V? 10w
Soldering angle	焊錫角度	Adjustable 4-6 °
Dimension	機體尺寸	3740(L)*1350(W)*1650(H)mm
Total Power Consumption	總功率	Approx. 23kw
Power Supply	電源	3￠ 380V 50Hz
Net Werght	凈重	Approx. 900kg